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AMETEK ECP
»
RESOURCES
»
Choices in Electronic Packaging
»
Material Selection
»
Microelectronic packages
»
Microelectronic packages
1. Body materials
Kovar – low expansion to minimize stress when substrates are mounted – closely matches commonly used materials such as GaA
Alloy 42 – lowest cost per unit weight of material
Alloy 48 - to match CTE of special thermal bases
300 series Stainless steel – to match CTE of special substrates
Monel – suitable for soldering without additional plating
Invar – near-flat
CTE
curve at soldering temperatures
Aluminum – thermal conductivity, light weight; machinable; weldable; - contacts are soldered in place
Titanium (Ti6Al4V & CP) – light weight; bio-compatible; weldable – can be direct sealed
Copper – thermal conductivity
Tungsten-Copper Composites – thermal conductivity; heat dissipation required
Molybdenum-Copper Composites - thermal conductivity; heat dissipation required
AlSiC – light weight; thermal conductivity; heat dissipation required
GlidCop – light weight; thermal conductivity; heat dissipation required
Brass – thermal conductivity; not directly sealed - contacts are soldered in place
2. Contact materials
Kovar – for matched seals
Copper cored Kovar – electrical conductivity
Alloy 52 – for compression seals
Copper cored Alloy 52 – electrical conductivity
Copper – electrical conductivity; not directly sealed in
Copper-Zirconium Composite – stiffness; conductivity
GlidCop – conductivity
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