Coining Cover Assemblies offer many advantages for hermetic sealing processes of electronic packages over techniques using separate solder preforms and covers. The base material, either Kovar™ or Alloy 42, is electroplated with nickel (nickel plating) for solderability and to prevent corrosion in the future. The base is then electroplated with gold (gold plating) to provide a highly solderable surface. Finally, the base is welded to a solder preform.
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