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AMETEK's Component and Wire business manufactures metallic, custom-shaped solder and braze preforms (including popular gold tin and pure gold preforms) used in producing semiconductors under the Coining brand. We are the largest solder preform manufacturer in the world. Coining estimates that it produces more than twice as many solder preforms annually (in both units and dollars) as its nearest competitor.  Coining also produces a wide range of custom precision parts, and fine wire for electronic packaging.
  • Single Seals
    Hermetic Terminals and End Seals

    AMETEK Hermetic Seal has manufactured millions of hermetic single seal terminals

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  • Aluminum-Clad-Copper Bond Pad  Al CU Bond Pads for Power Semiconductors | AMETEK Coining
    Bond Pads

    Bond Pads make a high-current, conductive connection with Al-wire/ribbon between a power semiconductor and Cu-based PCB

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  • AMETEK Electronic Components and Packaging Microstampings
    Metal Microstampings

    Small metal stampings that dissipate heat are used as jumper chips, bonding pads, covers, heat sinks, lead frames, tabs, terminals or other components on microelectronic assemblies and packages

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  • AMETEK Electronic Components and Packaging Transistor Outlines
    Transistor Outlines

    Transistor Outlines are hermetically sealed metal packages that conform to JEDEC standard. AMETEK offers a source of supply for most of these configurations.

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  • Spheres

    Coining spheres are precise, spherically shaped parts formed from specially alloyed materials. They often are used as jointing components instead of more conventional flat preforms when either: 1) the part geometries surrounding the preform are better joined using a spherical shape rather than a flat shape, or 2) the alloys involved are not capable of being stamped into a flat shape.

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