News At A Glance

Recent Product News
  • Wednesday, March 15, 2017

    AMETEK ECP To Unveil Updated SMPS Test Data at OFC 2017

    The SMPS is the latest addition to AMETEK ECP’s SMPx Series of hermetic, push-on and blind-mate RF connectors, which includes the SMP and SMPM connectors.

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  • Friday, April 29, 2016

    AMETEK HSC ADDS OPTICAL LABORATORY

    As today’s specialty optical components market expands into increasingly harsh environments in oil and gas, aerospace and industrial applications, there is a growing need for reliable hermetic terminations

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  • Friday, March 18, 2016

    AMETEK ECP Introduces New SMPS Hermetic RF Connector With Improved Performance Ahead of OFC 2016

    AMETEK Electronic Components & Packaging has introduced the SMPS (Sub-Miniature Press-on-Sub-micro) hermetic miniature RF connector ahead of this year’s OFC

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  • Thursday, February 11, 2016

    Coining Inc. Introduces Ceramic Cover Assemblies

    Coining Ceramic Cover Assemblies (CCCAs)offer many advantages for hermetic sealing of electronic packages. The one piece, cover-frame construction simplifies assembly and eliminates seal failures caused by misalignment of lid and frame.

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Recent Business News
  • Wednesday, March 21, 2018

    AMETEK Sealtron Completes AS9100 Standard Audit

    Sealtron, Inc., a unit of AMETEK Electronic Components & Packaging (ECP), has successfully completed the newest standard AS9100 rev.D upgrade audit, which goes beyond the more common ISO9001 standard and adds more stringent requirements tailored to the demanding needs of the aerospace industry.

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  • Monday, March 5, 2018

    Sealtron Recertified to ISO9001: 2008 ASD-CERT

    Sealtron, Inc., a unit of AMETEK Interconnect Technologies, has completed the steps required by the ASD-CERT mandated body for the recertification of ISO 9001:2008 ASD-CERT. The non-profit association qualifies standard aerospace products and approves the quality system used in their manufacture.

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  • Tuesday, January 9, 2018

    AMETEK Electronic Components & Packaging Announces Executive Appointments

    AMETEK Electronic Components & Packaging (ECP) announces several key leadership appointments. Liam Shanahan has been named Engineered Interconnect and Packaging Business Unit Vice President. He previously managed AMETEK’s Interconnect business unit.

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  • Friday, April 15, 2016

    AMETEK HSC Awarded ISO9001 and AS9100 Recertification

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