HTCC Design Guide

Tuesday, May 6, 2014

iMAPS New England is the largest regional microelectronics event.    In 2014 iMAPS New England featured presentations by 36 industry experts discussing today’s opportunities and challenges, including Ken McGillivray from AMETEK Electronic Components and Packaging.    Ken discussed the design advantages of HTCC, such as highest Input/Output terminal density, weight reduction, and higher levels of reliability than GTMS and LTCC.

Download this informative ceramic ceramic design guide now.