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Electronic Packaging

Hermetic Packaging
About Us

Microelectronic Packaging

Hermetic microelectronic packaging, connectors, headers, and substrate solutions that utilize custom metal working capabilities as well an expertise in Glass-to-Metal Sealing (GTMS), Ceramic-to-Metal Sealing (CTMS),and High-Temperature Cofired Ceramic (HTCC).

Design Expertise

AMETEK has been in the microelectronic packaging industry for over sixty years. Our highly trained staff is dedicated to customers’ needs. AMETEK’s experienced engineering staff uses the latest CAD and CAM software to design all aspects of manufacturing, fixturing, process control and quality engineering. These cross-functional teams are highly motivated and focused on quality and on-time manufacturing. AMETEK works closely with its customers’ engineers to design the most producible and cost-effective solution.

Vertically Integrated Supply Solution

AMETEK is vertically integrated in its design and manufacturing capabilities. AMETEK has an extensive tooling inventory and can create new tooling in-house to assist its customer in reducing time-to-market and product cost. AMETEK custom designs all shipping trays to protect products in transit. With over 150,000 sq. ft. of combined manufacturing space in the U.S. and Malaysia, AMETEK can be a single source for all microelectronic packaging needs. AMETEK has wide working knowledge and experience in using various metal, glass materials, and ceramic configurations to suit customer designs. Meeting 1 x 10-9 in AMETEK’s finished product is routinely accomplished, exceeding the requirements of all current military connector specifications.