Aluminum Wire and Ribbon

Coining Bond Wire Products
Aluminum Wire
Coining specializes in supplying Aluminum wire which is used in microelectronics devices as an electrical interconnect, either between a chip and substrate or between two chips. Our in-house drawing, rolling, annealing and analytic capabilities ensure we deliver homogeneous high purity wire & ribbon with ultra clean surfaces and smooth finish.

 

Al wire is used throughout the electronics industry due to its low cost, suitability for ultrasonic wedge bonding and eliminates the problem of “purple plague” associated with gold wire bonded to an aluminum contact. Aluminum is particularly suitable for ultrasonic bonding. 

Alloyed Al wires are generally preferred to pure Al because of greater drawing ease to fine sizes and higher pull test strengths in finished devise. Also, the addition of nickel makes the Al wire corrosion resistant.

Ribbon
Coining also offers Al ribbon which is typically utilized in microwave and high power applications. Choice between wire or ribbon is determined by several factors. Ribbon offers better electrical characteristics, improved heat dissipation, fewer bonds, improved throughput and increased reliability over wire.

SPM-Power-Bond-Ribbon
Bonding of power devices is experiencing a rapid transition to aluminum ribbon for many reasons. Better electrical characteristics, improved heat dissipation, fewer bonds, improved throughput and increased reliability are some of the most obvious advantages. Coining offers SPM Power Bond Ribbon™, a high purity corrosion resistant aluminum bonding ribbon, to meet this demand.

  • Application Notes +


    SPM-Power-Bond-Ribbon

    Bonding of power devices is experiencing a rapid transition to aluminum ribbon for many reasons. Better electrical characteristics, improved heat dissipation, fewer bonds, improved throughput and increased reliability are some of the most obvious advantages.

    Coining offers SPM Power Bond Ribbon™, a high purity corrosion resistant aluminum bonding ribbon, to meet this demand.

    Spooling:  Coining has specifically designed spools for SPM Power Bond Ribbon™. The spool type is designated as 41R and is a foil feed type of spool slightly wider than the ribbon width. The 41R spool is fully compatible with all bonding machines configured for standard 41B heavy wire spools. The use of this spool eliminated the chance of the ribbon underwinding and potential despoiling issues.

    Using SPM Power Bond Ribbon™ eliminates the need for multiple wire bonds. The current required with two, three and even four bonds to the same device can now be attained with the properly selected ribbon. To determine the ribbon size needed, use this formula:

     (T) x (W) = (N) x (D²) x (0.785), where T = thickness of ribbon  
      W = width of ribbon  
      N = number of wire bonds  
      D = diameter of wire 

    Select a width and the required thickness can be determined.

    Equivalent Number of Wires to Ribbon Conversion

    Ribbon

    Wire Diameter (mils)

    Size (mils)

    5

    8

    10

    12

    15

    20

    30 x 3

    4.6

    1.8

    1.2

    40 x 4

    8.2

    3.2

    2.0

    1.4

    50 x 5

    12.7

    5.0

    3.2

    2.2

    1.4

    40 x 6

    12.2

    4.8

    3.1

    2.1

    1.4

    60 x 6

    18.3

    7.2

    4.6

    3.2

    2.0

    1.2

    80 x 6

    24.4

    9.6

    6.1

    4.2

    2.7

    1.5

    50 x 8

    20.4

    8.0

    5.1

    3.5

    2.3

    1.3

    60 x 8

    24.4

    9.6

    6.1

    4.2

    2.7

    1.5

    80 x 8

    32.6

    12.7

    8.2

    5.7

    3.6

    2.0

    60 x 10

    30.6

    11.9

    7.6

    5.3

    3.4

    1.9

    80 x 10

    40.7

    15.9

    10.2

    7.1

    4.5

    2.6

     


     

  • Data Sheets or Catalogs +