Optical Modulator Housings

Optical Applications, GPPO, G3PO, Electronic Packaging AMETEK ECP

AMETEK Glass to Metal Seals (GTMS) and Ceramic to Metal Seals (CTMS) are used in several optical communication applications, including optical networking components and RF frequency test and measurement equipment among others.  AMETEK’s ability to help customers develop products to meet demanding specifications allows AMETEK to win their confidence and develop long-term relationships.  Additionally, AMETEK’s reputation for excellence in developing custom hermetic interconnect and thermal microelectronic packaging solutions creates opportunities to share expertise across various customer applications.


AMETEK ECP’s modulator housing design offers versatility and reliability for today’s high-performance optical equipment. The housing is designed to enable optical devices used for 100G and 400G applications for long-haul, metro and data center interfaces.

A Small Form Factor (SFF) housing footprint compliant to the OIF 100G Implementation Agreement is also available.

KEY FEATURES
Hermetic housing
Rugged design
Various RF connectivity options including the newlypatented S-BEND Ceramic Feedthrough (in development)
Bandwidth performance to 400G
Various body material and plating options
Performance that meets or exceeds industry standards

Housing:
Material: Stainless steel, cold-rolled steel, Kovar, high-Nickel alloys (Monel, Inconel, Hymu-80)
Construction: Single piece machined, multi-piece machined

DC Connectors:
Construction: Direct seal, brazed terminals, welded connector
Insulator: Glass, alumina
Leads: Flat or round, straight or gull-winged

RF Connectors:
Construction: Direct seal, brazed terminals, welded connector
Insulator: Glass, alumina
Inside Termination: Rounded end, straight cut, turned down, flattened
Outside Termination: SMA series, SMPx series, S-BEND Ceramic Feedthrough (in development)

Input/Output Ports:
Construction: Integrally machined in the housing, multi-piece brazed or welded
Design: Straight, angled, single or dual, round or square or rectangular, slots or holes provided for soldering
Plating: General, selective

Plating: Metals: Ni (electrolytic or electroless), Au (electrolytic or electroless), Ag, Pd
Type: General, selective

Workmanship and Performance Standards:
• JEDEC Standard 9
• Mil-Std-883
• Mil-Std-202
• Telcordia