In addition to producing preforms, Coining makes small metal stampings that are used as jumper chips, bonding pads, covers, heat sinks, lead frames, tabs, terminals or other components on microelectronic assemblies and packages. These precision stampings are used primarily to dissipate heat or provide an interface for an electronic circuit or component.
We work with Kovar™ , molybdenum, tungsten, copper, Silvar™ , Silvar-K™ and various other metallic materials commonly found in metal and ceramic packages. Some of these parts are supplied after nickel plating or gold plating. Other Coining stampings are manufactured from cladded strip consisting of two or more metal layers bonded together in a specialty rolling operation, also called metallic bonding.
Coining primarily focuses on two-dimensional microstampings with constant cross-sectional thicknesses less than 0.030 inch (0.75 mm). However, we can produce some parts that vary in the third dimension. We welcome inquires with drawings and will respond quickly with technical feasibility and pricing if appropriate.
Click here for a paper that provides additional detail on Coining's Micro Stamping Capabilities.
View our Silvar™ and Silvar-K™ datasheets below: