AMETEK ECP is being featured in this month’s edition of Connector + Cable Assembly Supplier.
The e-publication is currently covering the buildup to this year’s Optical Fiber Communication Conference and Exhibition (OFC) due to begin in Anaheim on March 20th.
In its article aptly named “Inside the 2016 OFC Conference and Expo”, the article compiles interview questions and commentaries from various participating companies on their expectations for the exhibition and conference.
AMETEK ECP will showcase its hermetic packaging, GTMS and HTCC capabilities at the show. It will also emphasize its RF expertise, including updates on last year’s OFC launch of the S-BEND Ceramic Feedthrough.
“We believe that the next-generation 400G systems, including modulators, TOSA/ROSA modules, and coherent receivers will dominate the exhibition hall”, says Ildar Bekbay, Business Development Manager for AMETEK ECP.
The full article is available at: www.connectorsupplier.com/inside-the-2016-ofc-conference-and-expo/