Learn More about Coining

  • AMETEK Electronic Components and Packaging - Coining brand logo
    Our Story

    Our customers enjoy exceptionally fast lead-times, reliable on-time deliveries, right-the-first-time-and-every-time quality and outstanding customer service from quotation request until order fulfillment.

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  • Coining shop floor, mechanical engineering capabilities
    Coining Capabilities

    Coining can work with a wide variety of brazing and soldering alloys. We are most commonly called upon to manufacture with alloys of gold, silver, lead, tin, zinc, antimony, copper, indium, iron, molybdenum, nickel, tungsten and Kovar™. We are also comfortable with special alloys such as those including germanium, palladium and platinum. Even alloys including additives of gallium, silicon and phosphorus are processed on a routine basis. We are always willing to work with a new alloy, even if a limited quantity is needed.

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  • AMETEK Electronic Components and Packaging - Stamping
    Stamping

    We can produce standard, custom and complex shapes quickly and efficiently. Our custom fabrication capabilities are limited only by the physical constraints of the materials at hand. Essentially, if a shape is possible, it is almost certain that Coining can fabricate it - quickly. precisely and efficiently!

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  • AMETEK Electronic Components and Packaging - Components and Wire Press
    Cladding and Plating

    Cladding is a multi-step process where two or more metals are joined or bonded together in strip form under high pressure without adhesives or filler materials.

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  • AMETEK Electronic Components and Packaging - Components and Wire Rolled Metal Products
    Alloying Casting Rolling and Slitting

    Coining's backward integration strategy minimizes lead times. If we need it, we control it; We make it happen, fast and right the first time. Alloying is a process in which two or more metal elements are melted together in a precise combination. Casting re-melts to form a cast strip or rod. Rolling reduces thickness and hardness, then slit to specified width and cut to necessary length, then rolled onto a coil ready for stamping

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  • AMETEK Electronic Components and Packaging - Drawing and Annealing
    Drawing and Annealing

    Coining's drawing and annealing processes are utilized to manufacture wire to diameters as fine as 0.0005 inch (12.5 microns).

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  • AMETEK Coining technician uses a Zeiss scanning electron microscope with AMETEK EDAX silicon drift detector to perform laboratory analysis.
    Lab Services

    Coining's A2LA certified analytical laboratory is now offering analytical and failure analysis services. The laboratory is equipped with the latest generation of instruments to measure bulk compositions, trace impurities and bulk physical characteristics.

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  • Components and Wire Tape
    Packaging

    Coining packages parts in embossed or pocketed plastic trays called waffle packs. Coining's tape & reel packaging service is a value-added process of placing preforms and other microstampings onto carrier tape before shipping to customers. Our products are used in this manner to feed automated assembly operations.

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  • AMETEK Electronic Components and Packaging - Components and Wire Products - Tool and Die
    Tooling

    Coining has a fully equipped tool die department with wire EDM capability. All dies are made in house. Even when a new tool is needed for your custom part, delivery is generally two to four weeks.

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  • ANAB provides accreditation for ISO/IEC 17021 certification bodies
    Quality

    Coining will produce and deliver quality products on time and provide service which meets or exceeds our customers' expectations.

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  • Semiconductor Packaging Materials
    Coining Acquires SPM

    Semiconductor Packaging Material manufactures solder preforms, jumper chips, bonding pads, heat sinks, lead frames, solder spheres, bonding wire and ribbon for microelectronics packaging and assembly applications

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